Method for manufacturing electronic module, involves penetrating fixing portion into not yet hardened casting portion, so that housing cover is fixed after hardening of casting portion to housing, over the casting portion

摘要

The method involves placing the circuit board (6) in the interior (22) of the housing (2). The mounting opening is closed by the housing cover (3). The curable casting portion is introduced into the interior of the housing in a not yet hardened state, and the mounting opening is closed by the housing cover. One of the fixing portions provided in the housing cover is penetrated into the not yet hardened casting portion, so that the housing cover is fixed after hardening of the casting portion to the housing, over the casting portion. An independent claim is included for electronic module.