发明名称 RADIANT HEAT SUBSTRATE AND METHOD FOR MANUFACTURING OF RADIANT HEAT SUBSTRATE
摘要 <p>A heat radiation substrate according to an embodiment of the present invention includes a heat sink which includes a plurality of holes with preset depths formed on the lower side thereof, a mounting pad which is formed on the heat sink and mounts a control element and a power element, a conductive pattern layer which includes a circuit pattern, and an insulation layer which is formed between the heat sink and the conductive pattern layer.</p>
申请公布号 KR20140043629(A) 申请公布日期 2014.04.10
申请号 KR20120109699 申请日期 2012.10.02
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 LEE, YOUNG KI;KIM, KWANG SOO;SUH, BUM SEOK;HONG, CHANG SEOB;CHAE, JOON SEOK
分类号 H05K7/20;H05K1/02 主分类号 H05K7/20
代理机构 代理人
主权项
地址