SUBSTRATE FOR BONDING SEMICONDUCTOR LAMINATE AND PROCESS OF MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a substrate for bonding a semiconductor laminate containing an AlN sintered substrate capable of being excellently bonded to a semiconductor laminate by a lift-off method.SOLUTION: A substrate 10 for bonding a semiconductor laminate includes an AlN sintered substrate 12 and a metal film 14 on the AlN sintered substrate 12, where surface roughness Ra of the metal film 14 is 50nm or less.