COOLING OF SEMICONDUCTOR DEVICES

摘要

A semiconductor device such as an LED illumination device includes a substrate sheet (2) and a plurality of LEDs (4) that are supported on the front of the substrate sheet. A plurality of apertures (9) extend through the substrate sheet (2) and thermally conductive elements in the form of conduits or tubes (1) extend through the apertures, while thermally conductive elements in the form of pads (10) extend between the LEDs and the tubes (1). Each tube (1) defines an open passage that extends through the apertures (9) between the front and the back of the substrate sheet (2), without obstruction. Heat generated in the LEDs is conducted to the tubes (1), from where it is dissipated through convection.