| 摘要 |
A light emitting device is provided to induce the most of lights emitted from a light emitting diode chip to the light extraction surface by forming the underfill resin part with the white color resin. A light emitting device comprises a ceramic substrate(11), a light emitting diode chip(12), and an underfill resin part(15). The light emitting diode chip comprises a transparent resin film(13), a side resinous film(14), and conductive bumps(16a,16b). The wiring structure of the light emitting diode chip comprises the first and second electrode patterns(17a,17b) and a conductive via(v). The light emitting diode chip comprises the first and second conductive bumps. The transparent resin film is formed in the light extraction surface of the light emitting diode chip. The transparent resin film performs the function for protecting the light emitting diode chip. The fluorescent substance particle is dispersed on the transparent resin film and radiates the white light. |
