| 摘要 |
PROBLEM TO BE SOLVED: To provide the mount of a substrate for processor, and an I/O configuration of the mount.SOLUTION: A high speed I/O trace is a part of an I/O package architecture for an integrated circuit package substrate. The integrated circuit package substrate has an integrated heat spreader footprint on the die side, and the I/O trace to be coupled with an IC device provided in the integrated heat spreader footprint. The I/O trace has a pinout terminal provided on the outside of the integrated heat spreader footprint, and being coupled with an IC device provided on the outside of the integrated heat spreader footprint. The I/O trace can maintain the data flow rate from the processor within a range of 5-40 Gb/s. |
