| 摘要 |
PROBLEM TO BE SOLVED: To provide an IC chip joint method having high reliability of contact of a base material to wiring.SOLUTION: In an IC chip joint method, an anisotropic conductive adhesive layer of thermosetting type is formed between a bump of an IC chip and a base material pattern and the IC chip and the base material are heated, pressed and joined together by holding them in place with an upper/lower head comprising an upper head provided with a heating unit disposed above the IC chip and able to move in the vertical direction and a lower head provided with a heating unit disposed below the base material and able to move in the vertical direction. The IC chip joint method includes: a placement step of mounting the bump of the IC chip on the base material pattern having conductive adhesive coated thereon; a preheating step (S16b, S16c) of preheating the coated conductive adhesive at a thermosetting temperature or below by causing the upper head to contact the IC chip or the lower head to contact the base material after the IC chip is placed; and a joint step (S22) of applying pressure by sandwiching with the upper/lower head after the preheating step to heat the conductive adhesive up to the thermosetting temperature. |
