| 摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus and a method for allowing coating-formation at further improved deposition speed than conventional sputtering deposition, while maintaining a quality of a coating obtained when a material is sputter-deposited on an article to form a coating using a magnetron sputtering apparatus.SOLUTION: Cooling liquid is circulated across an almost entire face of a rear face of a target of a magnetron, to effectively cool the magnetron. Furthermore, by using a relatively high magnetic field in the magnetron, while at the same time increasing power to the magnetron by increasing the current at a rate faster than the voltage increase rate, a sputter deposition speed can be increased without damaging the formed coating. |
