| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing device and an SOI wafer polishing method using the polishing device, which can inhibit formation of a wing shape on an outer periphery of a work.SOLUTION: A polishing device comprises a polishing cloth attached to a surface plate and a polishing head. The polishing head includes: a holding plate having a ring member arranged on an outer periphery of a disc-like plate so as to extend downward; a backing material which is attached to an undersurface of the ring member of the holding plate and includes a resin foam layer which a rear face of a work abuts; fluid supply means for supplying a fluid to a pressure chamber surrounded by the holding plate and the backing material to pressurize the backing material; and a ring-shaped template arranged on a peripheral part of an undersurface of the resin foam layer of the backing material, for holding an edge part of the work. The template is arranged to project inward with respect to an inner peripheral surface of the ring member of the holding plate and includes a pressing member for pressing the projected part of the template from above via the backing material. |
