发明名称 SUBSTRATE DEVICE FOR CONTACT TYPE IC MODULE
摘要 PROBLEM TO BE SOLVED: To initialize a plurality of IC modules simultaneously without requiring a plurality of initialization devices.SOLUTION: A substrate device includes: a substrate mounting a plurality of IC modules that have external terminal part made of a plurality of kinds of contact terminals; and a plurality of wiring lines which are placed on the substrate and connect the same contact terminals among the different IC modules. By connecting the plurality of wiring lines in parallel on a single initialization device, the plurality of IC modules are initialized simultaneously.
申请公布号 JP2014063303(A) 申请公布日期 2014.04.10
申请号 JP20120207461 申请日期 2012.09.20
申请人 TOSHIBA CORP 发明人 ARAI HIDEAKI
分类号 G06K17/00;G06K19/077 主分类号 G06K17/00
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