发明名称 |
HEAT PUMP SYSTEM AND COOLING SYSTEM USING THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide a heat pump system capable of reducing a temperature difference between the evaporator side and the condenser side, which is caused when heat is drawn by a heat pump, and achieving good efficiency.SOLUTION: A first heat pump 2 includes: a first evaporator 7; and a second evaporator 8. The second heat pump 3 is connected with the first heat pump 2 through an evaporator 12 serving as the first evaporator 7. A heat source fluid 16 is sequentially passed through the second evaporator 8 of the first heat pump 2 and an evaporator 14 of the second heat pump 3. A heated fluid 9 is heated without causing phase change in a condenser 5 of the first heat pump 2. |
申请公布号 |
JP2014062701(A) |
申请公布日期 |
2014.04.10 |
申请号 |
JP20120209018 |
申请日期 |
2012.09.24 |
申请人 |
MIURA CO LTD |
发明人 |
KANAMARU MASAYOSHI;KAWAKAMI AKINORI |
分类号 |
F25B7/00;F25B5/04;F25B27/00 |
主分类号 |
F25B7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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