发明名称 HEAT PUMP SYSTEM AND COOLING SYSTEM USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a heat pump system capable of reducing a temperature difference between the evaporator side and the condenser side, which is caused when heat is drawn by a heat pump, and achieving good efficiency.SOLUTION: A first heat pump 2 includes: a first evaporator 7; and a second evaporator 8. The second heat pump 3 is connected with the first heat pump 2 through an evaporator 12 serving as the first evaporator 7. A heat source fluid 16 is sequentially passed through the second evaporator 8 of the first heat pump 2 and an evaporator 14 of the second heat pump 3. A heated fluid 9 is heated without causing phase change in a condenser 5 of the first heat pump 2.
申请公布号 JP2014062701(A) 申请公布日期 2014.04.10
申请号 JP20120209018 申请日期 2012.09.24
申请人 MIURA CO LTD 发明人 KANAMARU MASAYOSHI;KAWAKAMI AKINORI
分类号 F25B7/00;F25B5/04;F25B27/00 主分类号 F25B7/00
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