| 摘要 |
Provided is a wafer mounting method that can prevent the structure of a wafer inspection device from becoming complicated. In a wafer inspection device (10) provided with a plurality of testers (15) and a transport stage (18) for transporting a wafer (W), expandable bellows (23) are placed so as to surround a probe card (20) of a tester (15), the wafer (W) is placed on a chuck top (28), which is a thick plate, the chuck top (28) is supported by the transport stage (18), the transport stage (18) is moved toward the probe card (20) to butt the chuck top (28) against the bellows (23) after the transport stage (18) is positioned, together with the wafer (W) and the chuck top (28), opposite the probe card (20), and the transport stage (18) is moved, together with the wafer (W) and the chuck top (28), toward the probe card (20) even after the chuck top (28) is butted against the bellows (23), so that the wafer (W) is butted against the probe card (20). |
