摘要 |
Resilient electrical interposers that may be utilized to form a plurality of electrical connections between a first device and a second device, as well as systems that may utilize the resilient electrical interposers and methods of use and/or fabrication thereof. The resilient electrical interposers may include a resilient dielectric body with a plurality of electrical conduits contained therein. The plurality of electrical conduits may be configured to provide a plurality of electrical connections between a first surface of the electrical interposer and/or the resilient dielectric body and a second, opposed, surface of the electrical interposer and/or the resilient dielectric body. The systems and methods disclosed herein may provide for improved vertical compliance, improved contact force control, and/or improved dimensional stability of the resilient electrical interposers. |
申请人 |
CASCADE MICROTECH, INC.;SMITH, KENNETH R.;JOLLEY, MIKE;STRID, ERIC;HANAWAY, PETER;GLEASON, K., REED;DUCKWORTH, KOBY, L. |
发明人 |
SMITH, KENNETH R.;JOLLEY, MIKE;STRID, ERIC;HANAWAY, PETER;GLEASON, K., REED;DUCKWORTH, KOBY, L. |