| 摘要 |
<p>Provided is a semiconductor device or the like, which, of the light that wraps around to a light-receiving element from a light-emitting element, is capable of preventing light reflected from a panel body or the like from reaching the light-receiving element. The semiconductor device (10) is formed by mounting the light-emitting element (12) and the light-receiving element (13) on a common package substrate (11). The light-emitting element (12) and/or the light-receiving element (13) are/is mounted on the bottom (15a) of an inverse truncated cone-shaped groove (15) formed in the package substrate (11) so as to be set in said groove (15). Furthermore, a surface (14a) of an encapsulating resin (14) is formed on the package substrate (11) by a sloped surface that slopes down toward the light-receiving element (13) from the light-emitting element (12).</p> |
