| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer processing method capable of surely removing a resin protruding from an outer periphery of a wafer.SOLUTION: A wafer processing method includes at least the steps of: wholly removing a chamfering part C of a wafer W; disposing a carrier plate on a surface WS of the wafer via a resin; removing the resin protruding from the outer periphery of the wafer W by dissolving it with a solvent; and thinning the wafer by grinding a rear surface WR of the wafer to such an extent that a Via electrode E is not exposed to the rear surface WR. |
