| 摘要 |
PROBLEM TO BE SOLVED: To enable efficient substrate processing by enabling change in position of a rear face Sb of a substrate S, where a backup pin B comes in contact without involving arrangement work of the backup pins B with respect to a base part 31.SOLUTION: In a substrate processing apparatus, backup pins B which come in contact with a rear face Sb of a substrate S for backup are switched among a plurality of backup pins B arranged on a base part 31. Accordingly, positions where the backup pins B come in contact with the rear face Sb of the substrate S in an overlapping support region Ro can be changed. That is, by switching the backup pins B which come in contact with the rear face Sb of the substrate S among the plurality of backup pins B previously arranged on the base part 31 but not performing arrangement work to change the arrangement of the backup pins B with respect to the base part 31, the positions on the rear face Sb of the substrate S where the backup pins B come in contact are changed in the overlapping support region Ro. |
