| 摘要 |
PURPOSE: A reel-to-reel type circuit board and a manufacturing method thereof are provided to reduce a process lead time by completely curing a solder resist layer through an electronic beam. CONSTITUTION: A circuit pattern layer(202) is formed on a core material(201). A raw material(203) for a photo solder resist layer is coated on the core material to cover the circuit pattern layer. An electronic beam mask(211) is arranged on the raw material for the photo solder resist layer. The photo solder resist layer is patterned by irradiating the electronic beam on the raw material for the photo solder resist layer. |
