ADHESIVE COMPOSITION FOR MASKING TAPE IN MOLD UNDERFILL PROCESS, AND MASKING TAPE USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide an adhesive composition for a masking tape in a mold underfill process, and a masking tape using the adhesive composition for a masking tape in a mold underfill process.SOLUTION: An adhesive composition for a masking tape in a mold underfill process according to the present invention includes: (a) an acrylic copolymer; (b) a thermosetting agent; (c) an energy-ray curable urethane resin; (d) an energy-ray curable silicone resin; (e) an energy-ray initiator; and (f) chemical particles.