PRODUCTION METHOD FOR MULTILAYER PRINTED WIRING BOARD, AND BASE MATERIAL

摘要

A production method for a base material used in the production of a multilayer printed wiring board includes: a step in which a resin, plate-like carrier is prepared; and a step in which, either a stacked body having a mould-release-agent layer stacked upon a metal foil therein is stacked upon at least one main surface of the plate-like carrier, or the mould-release-agent layer is stacked upon the metal foil which has already been stacked upon the at least one main surface of the plate-like carrier, so that the mould-release-agent layer is stacked upon the main surface of the plate-like carrier, with the metal foil located therebetween.