| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board having such a structure that a sealing resin injected for protecting the solder joint of a semiconductor chip and the wiring board, for a coreless type wiring board (FCBGA) not having a solder resist layer on the semiconductor chip side surface, does not spread from the gap of the semiconductor chip and the wiring board to other than a predetermined region on the wiring board surface, and to provide a manufacturing method therefor.SOLUTION: In a coreless type wiring board including terminal electrodes 3 arranged in array on the surface of a plurality of wiring layers and a resin layer 4 on the semiconductor chip mounting side, a ring-shaped conductor pattern 2 is exposed to the surface of the resin layer 4 so as to surround the terminal electrodes 3 arranged in array. The surface of the resin layer 4 is not covered with a solder resist layer. |
