发明名称 WIRING BOARD AND PROCESS OF MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a wiring board capable of simultaneously soldering to a plurality of boards and a process of manufacturing the same.SOLUTION: A first board 20 having a solder filling hole H1 at a top face and a second board 30 having a solder filling hole H2 at a top face are connected. The first board 20 and the second board 30 are electrically connected. The surfaces of the first board 20 and the second board 30 at which both solder filling holes are formed are at a same surface level.
申请公布号 JP2014063839(A) 申请公布日期 2014.04.10
申请号 JP20120207388 申请日期 2012.09.20
申请人 TOYOTA INDUSTRIES CORP 发明人 OZAKI KIMINORI;KOIKE YASUHIRO;ASANO HIROAKI;SHIMATSU HITOSHI;ASAI TOMORO
分类号 H05K1/14;H05K3/36 主分类号 H05K1/14
代理机构 代理人
主权项
地址