发明名称 PROTECTIVE LAYER OF METAL SURFACE AND METHOD FOR FORMING THE SAME
摘要 PROBLEM TO BE SOLVED: To form a metal surface protective layer excellent in heat/corrosion resistance and resistance against mechanical external stress, without using a complicated electrolytic plating process requiring a plating bath.SOLUTION: In a structure, a metal layer, in which metal particles having a melting point higher than that of Sn-containing metal are dispersed into a matrix comprising the Sn-containing metal, and a hardening layer comprising a binder containing a thermosetting resin are laminated on a material having a metal surface. The surface of each metal particle is covered with a Sn-containing intermetallic compound, and the metal layer and the hardening layer are separated each other to secure the lamination order of the metal surface, the metal layer, and the hardening layer.
申请公布号 JP2014063846(A) 申请公布日期 2014.04.10
申请号 JP20120207466 申请日期 2012.09.20
申请人 ASAHI KASEI E-MATERIALS CORP 发明人 KIYAMA TOMONORI;ONIZUKA KENZO
分类号 H01L21/60;B23K35/26;B23K35/30;C22C5/06;C22C9/00;C22C9/02;C22C12/00;C22C13/00;C22C19/03;C23C26/00;H01L21/52;H05K1/09;H05K3/34 主分类号 H01L21/60
代理机构 代理人
主权项
地址