| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive composition for an adhesive sheet for semiconductor wafer processing, capable of preventing generation of metallic contamination in a semiconductor wafer.SOLUTION: An adhesive composition for an adhesive sheet for semiconductor wafer processing of the present invention contains a (meth)acrylic polymer having an urethane bond. The (meth)acrylic polymer is a polymer obtained by using, as a catalyst, a complex of at least one metal selected from among zirconium, titanium and aluminum to perform a polymerization reaction. |
