| 摘要 |
Provided is a semiconductor device, or the like, that is capable of effectively preventing light from a light-emitting element from leaking onto a light-receiving element, while being easy to manufacture. The semiconductor device (10) is formed by mounting a light-emitting element (12) and a light-receiving element (13) on a common package substrate (11). At least one of the light-emitting element (12) and the light-receiving element (13) is mounted at the bottom (15a) of an inverse truncated cone-shaped groove (15), which is formed in the package substrate (11), so as to be set in said groove (15). A V-shaped optical groove (16), which is positioned between the light-emitting element (12) and the light-receiving element (13) and refracts light emitted from the light-emitting element (12) forward toward the light-receiving element, is formed in an encapsulating resin (14). |
