SEMICONDUCTOR DEVICES HAVING PASSIVE ELEMENT IN RECESSED PORTION OF DEVICE ISOLATION PATTERN AND METHODS OF FABRICATING THE SAME

摘要

A semiconductor device includes a substrate, a device isolation pattern and a passive circuit element. The device isolation pattern is located on the substrate, delimits an active region of the substrate, and includes a recessed portion having a bottom surface located below a plane coincident with a surface of the active region. The passive circuit element is situated in the recess so as to be disposed on the bottom surface of the recessed portion of the device isolation pattern.