发明名称 |
Ultrafast laser annealing with reduced pattern density effects in integrated circuit fabrication |
摘要 |
Systems and methods for performing ultrafast laser annealing in a manner that reduces pattern density effects in integrated circuit manufacturing are disclosed. The method includes scanning at least one first laser beam over the patterned surface of a substrate. The at least one first laser beam is configured to heat the patterned surface to a non-melt temperature Tnonmelt that is within about 400° C. of the melt temperature Tmelt. The method also includes scanning at least one second laser beam over the patterned surface and relative to the first laser beam. The at least one second laser beam is pulsed and is configured to heat the patterned surface from the non-melt temperature provided by the at least one first laser beam up to the melt temperature. |
申请公布号 |
US2014097171(A1) |
申请公布日期 |
2014.04.10 |
申请号 |
US201213646673 |
申请日期 |
2012.10.06 |
申请人 |
WANG YUN;HAWRYLUK ANDREW M. |
发明人 |
WANG YUN;HAWRYLUK ANDREW M. |
分类号 |
H01L21/428;B23K26/06;B23K26/08;B23K26/12;B23K26/18 |
主分类号 |
H01L21/428 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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