发明名称 VACUUM PROCESSING APPARATUS AND VACUUM PROCESSING METHOD
摘要 A semiconductor processing apparatus is provided, which includes processing chambers coupled together by transport mechanisms having transfer robots. After having completed wafer processing in each processing chamber, the allowable value of a time permitted for a processing-completed wafer to continue residing within the processing chamber is set up. Then, a time consumed up to the completion of transportation of a wafer scheduled to be next processed is estimated, thereby controlling a transfer robot in a way such that, when the estimated transfer time exceeds the allowable value of the waiting time, priority is given to an operation for unloading a processed wafer from the processing chamber insofar as the processed wafer's transfer destination is already in its state capable of accepting such wafer.
申请公布号 US2014099176(A1) 申请公布日期 2014.04.10
申请号 US201314023874 申请日期 2013.09.11
申请人 HITACHI HIGH-TECHNOLOGIES CORPORATION 发明人 NOGI KEITA;NAKATA TERUO;TAMAI KENJI;KAWAGUCHI MICHINORI;SUEMITSU YOSHIRO
分类号 H01L21/677 主分类号 H01L21/677
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