发明名称 LEAD-FREE HIGH TEMPERATURE/PRESSURE PIPING COMPONENTS AND METHODS OF USE
摘要 A piping component for controlling the flow of high-temperature fluids that includes a piping body having an inlet end and an outlet end, including methods of operating such components within a piping system. The piping body may be sized for fluids operating at temperatures from approximately 350°F up to approximately 500°F, and 650°F. The piping body may also be sized for high-temperature fluids (e.g., steam) operating at pressures of up to approximately 400 psi, and 600 psi. In addition, the piping body is made from a silicon-copper alloy consisting essentially of less than 16% zinc, less than 0.25% lead, less than 0.25% bismuth, 2 to 6% silicon and a balance of copper (by weight).
申请公布号 WO2014055642(A1) 申请公布日期 2014.04.10
申请号 WO2013US63059 申请日期 2013.10.02
申请人 NIBCO INC. 发明人 BOBO, DAVID, A.;CLARK, MARK, A.;EDDS, AARON, W.;LAWRENCE, BENJAMIN, L.;STUTSMAN, CHARLES, M.
分类号 F16K27/00;F16L9/02 主分类号 F16K27/00
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