Power module for motor cars, has electrical terminals arranged on upper surface of semiconductor chip, which is provided under carrier and embedded into cavity, and carrier provided with circuit board

摘要

The module (2) has electrical terminals arranged on an upper surface of a semiconductor chip. The semiconductor chip is provided under a silvered carrier i.e. copper layer, and embedded into a cavity. The carrier is provided with a circuit board. An O-shaped copper layer is located at the upper surface of the semiconductor chip. A gate (6) and an emitter (4) are arranged on different planes. An independent claim is also included for a method for manufacturing a power module.