| 摘要 |
PROBLEM TO BE SOLVED: To form a fillet with an appropriate width while preventing decrease in possibility of design of a semiconductor device having a flip-chip structure which has an irregularity on a lower side chip surface, which is associated with formation of wiring, for example.SOLUTION: A semiconductor device having a flip chip structure in which a second semiconductor chip is bump bonded to a first semiconductor chip comprises projections each of which strides across salients formed on a peripheral part of a bond region with the second semiconductor chip. With these projections, a resin which spreads to the salients where the projection is arranged can be poured into recesses among adjacent salients across a surface of the projection thereby to enable formation of a filet with an appropriate width. |
