| 摘要 |
PROBLEM TO BE SOLVED: To provide an optical device capable of performing surface activation bonding of all of respective optical components to a substrate at the same application load even when planar shape sizes of a plurality of optical components mounted on the substrate are different from one another.SOLUTION: Each of optical devices (2, 3, 4) comprises: a substrate (10); a plurality of optical components (20 and 30) which are different in a planar shape size, adjacent to each other, subjected to surface activation bonding to the substrate and optically coupled to each other; and a plurality of bonding portions (40, 60, 70, 80) provided on the substrate correspondingly to the plurality of optical components and including metallic micro bumps (41, 61, 71, 81) for bonding respective optical components. In each of the plurality of bonding portions, the total area of the upper surfaces of micro bumps to be bonded to a corresponding optical component at one bonding portion is nearly the same as that at the other bonding portion. |
