WIRING BOARD AND MANUFACTURING METHOD OF THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a wiring board manufacturing method capable of manufacturing a wiring board which has a via connection part having less electric conduction resistance capable of responding to high current and which can be downsized.SOLUTION: A wiring board manufacturing method comprises: forming a salient 24 on a first copper plate 22; injecting a thermosetting polyimide resin 26 to a position lower than a tip part of the salient 24; pressing a second copper plate 28 against the tip part of the salient 24 and performing pressurization press to join the salient 24 with the second copper plate 28 by plastic deformation of the salient 24 and a part of the second copper plate 28 which contacts the salient 24 to form a via connection part 32; and thermosetting the thermosetting polyimide resin 26 to form a wiring pattern 34 by etching the first copper plate 22 and the second copper plate 28 to form a wiring pattern 34.