发明名称 Printed circuit board
摘要 <p>A printed circuit board includes an insulating layer and a conductive metal layer attached on the insulating layer. The conductive metal layer is grounded and is configured for providing grounding for electronic components mounted on the printed circuit board. The insulating layer includes an exposed portion free of the conductive metal layer thereon, and two pads are formed on the exposed portion of the insulating layer and are insulated from each other. An inductor is mounted on the exposed portion and is electrically connected to the two pads. </p>
申请公布号 EP2642834(A3) 申请公布日期 2014.04.09
申请号 EP20120165415 申请日期 2012.04.24
申请人 HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., LTD.;HON HAI PRECISION INDUSTRY CO., LTD. 发明人 GAO, FU-LI;LIN, KUO-PIN
分类号 H05K1/02;H05K1/18 主分类号 H05K1/02
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