| 摘要 |
<p>A protection housing for an RFID tag, including a first housing and a second housing and an encapsulation structure for encapsulating an RFID tag into the placement space formed by the first housing and the second housing, the first housing having a first extension part including at least one air conductive groove, an elastic body, and at least one first air conductive through hole. The air conductive groove has a cavity and an opening; the elastic body matches the shape of the air conductive groove and is inserted into the cavity of each air conductive groove and forms an elastic snap-fitted part therewith; and the first air conductive through hole is placed on a sidewall where the placement space is adjacent to the elastic snap-fitted part, with one end thereof being in communication with the placement space and the other end being in contact with the elastic body. When the air pressure in the placement space is higher than atmospheric pressure and reaches a preset threshold, the high pressure air presses the elastic body that is inserted in the air conductive groove from the first air conductive through hole to force the elastic snap-fitted part of the elastic body to form an air conductive duct after being pressed by the air pressure, thus the high pressure air is discharged out via the air conductive duct and the opening of the air conductive groove. The present invention enables the encapsulation product of the RFID tag to be resistant to high temperature and to meet the IP68 protection standard.</p> |
