| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent soldering crack or soldering peeling through reduction of bending stress added to an LED soldering part loaded on a flexible wiring board, and to enhance a heat dissipation property through enlargement of a contact area between the flexible wiring board and a heat transfer member and enhancement of their contact stability. <P>SOLUTION: An LED lighting device 100 is provided with a flexible wiring board 2 capable of elastically deforming with an LED loading area D1 with an LED 3 loaded on its surface, and a heat transfer member 6 transferring heat of the LED 3 outside through contact with a rear surface 2c of the flexible wiring board 2, and is in contact with the heat transfer member 6 in a state in which the flexible wiring board 2 is bent. The flexible wiring board 2 is formed on either side of the bending direction of the LED loading area D1, and includes a deformation alleviating area D2 for alleviating bending deformation of the LED loading area D1. <P>COPYRIGHT: (C)2012,JPO&INPIT |
