发明名称 METHODS AND APPARATUS FOR UNIFORMLY METALLIZATION ON SUBSTRATES
摘要 An apparatus for substrate metallization from electrolyte is provided. The apparatus comprises: an immersion cell containing metal salt electrolyte; at least one electrode connecting to at least one power supply; an electrically conductive substrate holder holding at least one substrate to expose a conductive side of the substrate to face the at least one electrode; an oscillating actuator for oscillating the substrate holder with an amplitude and a frequency; at least one ultrasonic device with an operating frequency and an intensity, disposed in the metallization apparatus; at least one ultrasonic power generator connecting to the ultrasonic device; at least one inlet for metal slat electrolyte feeding; and at least one outlet for metal salt electrolyte draining.
申请公布号 KR20140043445(A) 申请公布日期 2014.04.09
申请号 KR20147001808 申请日期 2011.06.24
申请人 ACM RESEARCH (SHANGHAI) INC. 发明人 WANG HUI;MA YUE;HE CHUAN;WANG XI
分类号 C25D5/02;C25D5/16 主分类号 C25D5/02
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