发明名称 SUB-MICRON DECAL TRANSFER LITHOGRAPHY
摘要 <p>The present invention provides a method of sub-micron decal transfer lithography. The method includes forming a first pattern in a surface of a first silicon-containing elastomer, bonding at least a portion of the first pattern to a substrate, and etching a portion of at least one of the first silicon-containing elastomer and the substrate.</p>
申请公布号 EP1891479(B1) 申请公布日期 2014.04.09
申请号 EP20060759191 申请日期 2006.05.05
申请人 DOW CORNING CORPORATION 发明人 HEEJOON, AHN;NUZZO, RALPH;SHIM, ANNE
分类号 G03F7/00;B41M1/34;B41M3/00 主分类号 G03F7/00
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