CONDUCTIVE PARTICLES, CONDUCTIVE MATERIAL AND CONNECTION STRUCTURE

摘要

Provided are: conductive particles capable of suppressing the clumping of a plurality of conductive particles, and reducing the connection resistance between electrodes when used in the connection between electrodes; and a conductive material using the conductive particles. These conductive particles (1) have substrate particles (2), and a conductive layer (3) disposed on the surface of the substrate particles (2) and including at least one type of metal component selected from the following: nickel, boron, tungsten and molybdenum. This conductive material includes the conductive particles (1) and a binder resin.