发明名称 |
FIRE-RETARDANT RESIN COMPOSITION, METAL-CLAD BASE LAMINATE FOR FLEXIBLE PRINTED CIRCUIT BOARD UTILIZING SAID COMPOSITION, COVER LAY, ADHESIVE SHEET FOR FLEXIBLE PRINTED CIRCUIT BOARD AND FLEXIBLE PRINTED CIRCUIT BOARD |
摘要 |
(PROBLEM) To provide a flame-retardant resin composition that has superior adhesion subsequent to curing and molding when used as a printed wiring board adhesive and that provides superior printed wiring board electrical characteristics; and a flexible printed wiring board metal-clad laminate, a coverlay, a flexible printed wiring board adhesive sheet, and a flexible printed wiring board employing this resin composition. (SOLUTION) The flame-retardant resin composition comprises a thermosetting resin, a hardener, and a phosphorus-containing polymer. |
申请公布号 |
EP2716718(A1) |
申请公布日期 |
2014.04.09 |
申请号 |
EP20120794115 |
申请日期 |
2012.06.04 |
申请人 |
ARISAWA MFG. CO., LTD. |
发明人 |
DOBASHI, SHU;TOYAMA, YUJI;KOIKE, TSUNEO;TAI, MAKOTO;LEBEL, MARC-ANDRE;LENS, JAN-PLEUN |
分类号 |
C08L101/00;B32B15/092;B32B27/18;B32B27/38;C08J7/04;C08K3/18;C08L21/00;C08L85/02;C09J163/00;C09J185/02;C09K21/14;H05K3/38 |
主分类号 |
C08L101/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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