WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD

摘要

An electrically conductive path (50) is configured from a first copper plate (30), a second copper plate (40), and solder (60). The first copper plate (30) has a first bent section (32) extended from a first joining section (31) joined to an electrically insulative board (20) and bent toward the rear surface of the electrically insulative board (20). The second copper plate (40) has a second bent section (42) which is extended from a second joining section (41) joined to the electrically insulative board (20), is bent toward the front surface of the electrically insulative board (20), and is disposed so as to cover, together with the first bent section (32), the inner wall surface of a base-material through-hole (21). Through-holes (43, 44) are provided in the portions of the second copper plate (40) which face the inside of the base-material through-hole (21). Solder (60) is filled between the first bent section (32) and the second bent section (42) including the insides of the through-holes (43, 44). The configuration provides a wiring board and a method for manufacturing a wiring board which are configured so that a large current can be conducted through the electrically conductive path which connects the first copper plate (30) and the second copper plate (40) and that the amount of an electricity conductive material which forms the electrically conduction path can be reduced.