发明名称 |
CIRCUIT BOARD |
摘要 |
<p>A method of manufacturing a circuit board includes providing a metal substrate and applying a dielectric layer to the metal substrate and sacrificial bumps on the dielectric layer. The method also includes printing a conductive seed layer on the dielectric layer and the sacrificial bumps and plating a conductive circuit layer onto the conductive seed layer. The method includes removing sections of the conductive seed layer and sections of the conductive circuit layer during a circuit common removal process</p> |
申请公布号 |
KR20140043482(A) |
申请公布日期 |
2014.04.09 |
申请号 |
KR20147004627 |
申请日期 |
2012.08.15 |
申请人 |
TYCO ELECTRONICS CORPORATION |
发明人 |
MALSTROM CHARLES RANDALL;MYERS MAJORIE KAY;GEIGER JOHN PATTON |
分类号 |
H05K3/44;H05K3/02;H05K3/04;H05K3/06 |
主分类号 |
H05K3/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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