发明名称 RADIATION-SENSITIVE RESIN COMPOSITION, AND CURED FILM, ARRAY SUBSTRATE AND METHOD FOR FORMING THEM
摘要 PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition which simultaneously achieves low temperature calcination and storage stability and has high radiation sensitivity, and to provide a cured film as an interlayer dielectric film, a protection film or a spacer, which is suitable for flexible display applications and is excellent in surface hardness, solvent resistance and dielectric constant. SOLUTION: A radiation-sensitive resin composition comprises: [A] an alkali-soluble resin obtained by copolymerizing (A1)at least one monomer selected from the group consisting of an unsaturated carboxylic acid and an unsaturated carboxylic acid anhydride with (A2) an epoxy group-containing unsaturated compound; [B] a quinonediazide compound; and [C] at least one curing agent selected from the group consisting of a benzene compound having an electron-attracting group and an amino group, a compound containing two benzene rings having an electron-attracting group and an amino group, a tertiary amino compound, an amine salt, a phosphonium salt, an amidine salt, an amide compound, a ketimine compound, a block isocyanate compound, an imidazole ring-containing compound and a clathrate compound. COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 KR101383588(B1) 申请公布日期 2014.04.09
申请号 KR20110102465 申请日期 2011.10.07
申请人 发明人
分类号 G02F1/13;G03F7/022 主分类号 G02F1/13
代理机构 代理人
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