| 摘要 |
Polyamide molding composition on the basis of transparent copolyamides, comprises: (a) 40-100 wt.% of at least one transparent copolyamide containing at least two diamines and one or more aliphatic dicarboxylic acids; (b) 0-60 wt.% of at least one further polymer comprising amorphous or partially crystalline homo- or co-polyamides, polyetheresteramides, polyetheramides and/or polyesteramides; and (c) 0-10 wt.% of usual additives comprising e.g. UV-stabilizers, heat stabilizers, radical scavengers and/or processing aids. Polyamide molding composition on the basis of transparent copolyamides, comprises: (a) 40-100 wt.% of at least one transparent copolyamide with a glass transition temperature of at least 80[deg] C and at most 150[deg] C, containing at least two diamines that are different from each other, comprising aliphatic or cycloaliphatic diamines, preferably with 6-36C, and one or more aliphatic dicarboxylic acid, preferably with 6-36C; (b) 0-60 wt.% of at least one further polymer comprising amorphous or partially crystalline homo- or co-polyamides, polyetheresteramides, polyetheramides and/or polyesteramides; and (c) 0-10 wt.% of usual additives comprising UV-stabilizers, heat stabilizers, radical scavengers and/or processing aids, lubricants, demolding agent, plasticizers, functional additives for influencing the optical properties, preferably the refractive index, impact modifiers, nanoscale fillers and/or additives, optical brighteners and/or dyes, where the concentration of cycloaliphatic diamine is at least 40 mole% and the concentration of aliphatic diamine is at least 10 mole%, relative to the total diamine content. Independent claims are included for: (1) a process for producing the polyamide molding composition, comprising providing the polymer components (a) and (b) in a known pressure vessel, with a pressure phase of 250-320[deg] C, with a subsequent relaxation at 250-320[deg] C, with a subsequent degassing at 260-320[deg] C, and discharging the polyamide molding compounds in rope form, cooling, granulating and drying the granules, compounding the components (a), and optionally (b) and (c) as granular form in an extruder at melt temperatures of 220-350[deg] C to form a rope, cutting with appropriate granules into pellets, where additives such as processing stabilizers, colored pigments, UV absorbers, heat stabilizers, flame retardants and other transparent polyamides, or polyamide 12, are added during the compounding step, to assist the molding composition; and (2) a molding part obtained from the polyamide molding composition by injection molding and injection-compression process at a mass temperature of 230-320[deg] C, where the instrument is adjusted by the temperature of 40-130[deg] C, and optionally the instrument with temperature of 40-130[deg] C after filling the cavity, an embossed printing is applied on the hot molding part. |
