发明名称 Method of material processing with laser pulses having a large spectral bandwidth and apparatus for carrying out said method
摘要 A method and device for processing materials with laser pulses having a large spectral bandwidth and a device for carrying out said method. The aim of the invention is to create an easy, flexible method enabling universally applicable processing which can, however, be adapted to specific processing and methodological requirements. According to the invention, one or several spectral parameters of the laser pulses, i.e. the spectral amplitude and/or spectral phase and/or spectral polarization thereof, is/are specifically modified, preferably according to a measuring process variable, in order to process material or during the occurrence of said processing. The invention is used in order to process material with laser pulses having a large spectral bandwidth, particularly femto-second pulses and pico-second pulses.
申请公布号 US8692155(B2) 申请公布日期 2014.04.08
申请号 US201113195501 申请日期 2011.08.01
申请人 BISCHOFF MARK;HACKER MARTIN;SAUERBREY ROLAND;STOBRAWA GREGOR;ZIEGLER WOLFGANG;CARL ZEISS MEDITEC AG 发明人 BISCHOFF MARK;HACKER MARTIN;SAUERBREY ROLAND;STOBRAWA GREGOR;ZIEGLER WOLFGANG
分类号 B23K26/00;B23K26/06 主分类号 B23K26/00
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