发明名称 |
UBM structures for wafer level chip scale packaging |
摘要 |
A wafer level chip scale semiconductor device comprises a semiconductor die, a first under bump metal structure and a second under bump metal structure. The first under bump metal structure having a first enclosure is formed on a corner region or an edge region of the semiconductor die. A second under bump metal structure having a second enclosure is formed on an inner region of the semiconductor die. The first enclosure is greater than the second enclosure. |
申请公布号 |
US8692378(B2) |
申请公布日期 |
2014.04.08 |
申请号 |
US201113312538 |
申请日期 |
2011.12.06 |
申请人 |
YU TSUNG-YUAN;CHEN HSIEN-WEI;CHEN YING-JU;LIANG SHIH-WEI;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
YU TSUNG-YUAN;CHEN HSIEN-WEI;CHEN YING-JU;LIANG SHIH-WEI |
分类号 |
H01L23/34 |
主分类号 |
H01L23/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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