| 摘要 |
A high speed substrate processing system is provided to improve the productivity per area by efficiently using the space layout within the semiconductor manufacturing factory. The processing chamber(500) has the first substrate gateway(510) and a plurality of substrate support portions(520). The first transfer system(800) is installed inside the processing chamber and comprises a plurality of rotatable plate arms(810) for loading and unloading the processed substrate to the substrate support portion. The transfer chamber(400) is connected to the first substrate hole. And it has the second substrate hole(410). The second transfer system(600) is installed at the transfer chamber and exchanges the first transfer system and processed substrate through the first substrate hole. |
