发明名称 Semiconductor device and manufacturing method of the same
摘要 A semiconductor device includes a gate electrode formed over a semiconductor substrate, and a sidewall spacer formed on a sidewall of the gate electrode. The sidewall spacer formed along the sidewall parallel to a gate length direction of the gate electrode has a first thickness, and the sidewall spacer formed along the sidewall parallel to a gate width direction of the gate electrode has a second thickness that is greater than the first thickness.
申请公布号 US8692331(B2) 申请公布日期 2014.04.08
申请号 US201313934759 申请日期 2013.07.03
申请人 FUJITSU SEMICONDUCTOR LIMITED 发明人 OKUNO MASAKI
分类号 H01L29/423;H01L29/772 主分类号 H01L29/423
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