发明名称 Wired circuit board and producing method thereof
摘要 A wired circuit board includes a metal supporting layer, an insulating layer formed on the metal supporting layer, and a conductive layer formed on the insulating layer. In the metal supporting layer, a reference hole for positioning is formed, and a stepped portion is formed so as to surround the reference hole.
申请公布号 US8692126(B2) 申请公布日期 2014.04.08
申请号 US20100805710 申请日期 2010.08.16
申请人 ISHII JUN;IGUCHI HIROTOSHI;NITTO DENKO CORPORATION 发明人 ISHII JUN;IGUCHI HIROTOSHI
分类号 H05K1/03 主分类号 H05K1/03
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