发明名称 |
CMP compositions and methods for suppressing polysilicon removal rates |
摘要 |
The present invention provides a chemical-mechanical polishing (CMP) composition suitable for polishing a silicon nitride-containing substrate while suppressing polysilicon removal from the substrate. The composition comprises abrasive particles suspended in an acidic aqueous carrier containing a surfactant comprising an alkyne-diol, an alkyne diol ethoxylate, or a combination thereof. Methods of polishing a semiconductor substrate therewith are also disclosed. |
申请公布号 |
US8691695(B2) |
申请公布日期 |
2014.04.08 |
申请号 |
US201013379911 |
申请日期 |
2010.06.18 |
申请人 |
MOEGGENBORG KEVIN;WARD WILLIAM;TSAI MING-SHIH;DE REGE THESAURO FRANCESCO;CABOT MICROELECTRONICS CORPORATION |
发明人 |
MOEGGENBORG KEVIN;WARD WILLIAM;TSAI MING-SHIH;DE REGE THESAURO FRANCESCO |
分类号 |
H01L21/302;B44C1/22;C09G1/02;C09K3/14;H01L21/3105;H01L21/321 |
主分类号 |
H01L21/302 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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