| 摘要 |
<p>The present invention provides an electrodeposited copper foil for a flexible wiring board, wherein handling in manufacturing and processing lines is easy, good bending and flexing are provided with heating during a film adhesion step, small electric devices can be accommodated, excessive coarsening of a crystal grain structure is minimized, and excellent fine pattern characteristics are provided. The electrodeposited copper foil of the present invention having excellent bending and flexing characteristics is such that a crystal distribution before heating (unprocessed) is such that a number of crystal grains less than 2μm in diameter within a range of 300μm×300μm is 10,000 or greater and 25,000 or less, and a crystal distribution after heating for 1 hr at 300° C. is such that the number of crystal grains less than 2μm in diameter within a range of 300μm×300μm is 5,000 or greater and 15,000 or less. The electrodeposited copper foil of the present invention is characterized in that a crystal orientation ratio (%) as measured by EBSD before heating (unprocessed) to that after heating for 1 hr at 300° C. is such that ratios of change after heating relative to before heating for the following totals: a total of the (001) plane and the (311) plane, a total of the (011) plane and the (210) plane, and a total of the (331) plane and the (210) plane are all within ±20%.</p> |
